Tie Bar Cut Die

bar cut punch and die

The tie bar cut die is mainly produced with high level of tungsten carbide or tool steel,It plays an important role in semiconductor packaging which has high requirements in the tolerance and stable performance.We are equipped with advance machining devices to produce the bar cut punch and die ,such as optical grinding from Waida and Wasino,E.D.M sinker from Sodick.All slots are grind by profile grinding with great surface finish and tolerance ,which can improve tooling life by 50-100% for trim mold.We used the qualified tungsten carbide with well-known brand ,such as FUJILLOY, Kennametal,EVERLOY ,CERATIZIT and so on.They have higher resistance for certain precision metal stamping operation, reduce the maintenance time of metal die tooling.

Show Case

Tie bar Cut Die

Tie bar Cut Die

The slot of the cut die’s teeth is very small ,The Wire EDM process can’t achieve the surface requirement. The profile grinding wheel can grind the slots with width 0.2mm and depth 5-6 mm

Custom Cut Die

Custom Cut Die

Various of complex can be reached by precision manufacturing process,such as Sinker EDM for machining the harden material Asp23 with HRC62-64,The tolerance can reach +/-0.002mm.

Carbide Cut Die

Carbide Cut Die

There’s high precision in semiconductor industry ,we produce various of cut dies with advanced equipment,then assemble them for packaging the tools in the semiconductor.

Main Manufacturing Process for Tie Bar Cut Die

SpecificationsDetails
MaterialsTungsten Carbide (F10,F20,KD20,HS40,HS25 and more )
Manufacturing ProcessSurface Grinding,Profile Grinding.
Accuracy+/-0.002mm
Parallelism+/-0.002mm
Flatness+/-0.002mm
Surface Finish0.4μm (polish)
Surface Treatment DLC /TIN/TICN coating
Inspection InstrumentsCoordinate Measuring,Tool Microscope,Height Gage,Surface Plate,Gage Blocks,Micrometer,Slide Caliper.
Typical Lead TimeAS short as two days for urgent

The Application of Bar Cut Die In The Semiconductor Industry

Semiconductor cut steel molds include mutual cooperation upper cutting tool and lower cutting tool,they’re working in mutual cooperation .The upper cutting tools including its ontology and punch as a body of the blade, the lower cutting tool has placed the semiconductor product ontology pits and the carbide dies working as blade tooth, There are some clearance between the punch and die tooth blade set corresponding to the blade slot between blade than stated on the cutter body thin, between end face and horizontal bevel edge. When cutting  the blade of the carbide bar cut punch is tilted and gradually cut, which can reduce burr, pin damage and residual waste ribs while ensuring the cutting effect. And one-sided contact can be reached with the cutting bar at a certain Angle, to make sure the tool wear is small, so that the service life of the semiconductor cutting bar mold can be increased greatly

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